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traditional definition , yes, it has Morpheus Last edited by Morpheus : 2004-07-24 at 05:26. |
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Main features: (cont)
In order dispatch of up to five operations into distributed issue queue structure Out of order issue of up to 10 operations into 10 execution pipelines - Two load or store operations - Two fixed-point register-register operations - Two floating-point operations - One branch operation - One condition register operation - One VMX permute operation - One VMX ALU operation (tbc) Morpheus |
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What are the yields going to be on this monster? If IBM is having a hard time with the 970fx how are they going to make a chip that is (or almost) twice as big? I would think that it would be definitely for a high end machine.
Morpheus, any idea what speeds they are planning? |
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omgwtfbbq |
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Morpheus
You mention CMOS SOI10KE, but nothing about strained silcon. Just curious, the current 970FX reportedly is using a strained silcon process, but as I understand it not SSDOI(strained silcon directly on insulator). Why your omission of strained silcon, is IBM leaving strained silcon tech behind, or is my understanding of this teminology/process badly misconstrued? |
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Proof is in the pudding! That being said I'd guestamate they are shooting for 2.5 to 3 GHz and anything else would be a bonus. After all, TWO cores BOTH running at 3GHz would be amazing and the fact is 2.5 would be amazing considering: 970: ~131 mm 970-fx: 96 mm (I think) 970-mp: ~154mm 2 cores each with their own 1 MB L2 cache!! Heck the initial gpul and even the fx only had 512k. I have a feeling the MP is gonna SCREAM even if it **only** clock to 2.5GHz. I wish someone could invite 'programmer' over here I'd love to hear his input on these specs. I know I know - we shouldn't but... Dave |
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Not to answer your question, but here's a quick summary of Strained Si: By stretching the crystalline structure of the silicon, you can do two things. The first is that you can match it's structure with other materials. This means you might have better luck with SSOI since the Insulator might not have the same crystalline orentation or cell spacing as the Silicon. By straining the silicon, you can come close to matching the insulator structure and thereby bond the two materials together. You have to bond them together to get a decent chip. The second reason has to do with increasing the distance between the silicon atoms. When you increase the distance, you increase the probability that a mobile electron will move between two atoms without colliding with either of them. In macroworld terms, this means you have less resistance from the silicon which increases processor speed and reduces heat generation. To quote from a Nanotechnology book large enough to bludgeon you with: Quote:
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